Traditionally, many silica particle formation processes suffer from imperfections, such as empty particles (so called balloon particles) or simply damaged particles. Each of these imperfections increases the risk of the formation of fines. YMC's new production process produces perfectly smooth, spherical particles without these "balloon particles" (see scanning electron microscopy (SEM) images below). More importantly, however, particles produced with the new process also show narrow pore size and superior particle size distribution immediately after formation and therefore require less classification. Not only does this reduce the risk of subsequent particle damage, it also means that less energy is required for classification of the material. This results in the material having better performance with lower production costs.
This advantage of lower production costs is passed to you: the customer.
Trusted selectivity - always available:
Customers trust YMC to produce the same selectivity day after day, year after year. We certainly continue to deliver precisely this! Indeed we also continue to give our long term availability assurance: All those materials you currently use will continue to be available. We assure you that YMC will supply the materials currently in use in a validated production procedure or validated method with the same specifications and quality, for as long as the process / the method is running.
At the same time, the new HG-series materials will provide yet another option to lower costs and improve the efficiency of the preparative HPLC process. They are produced with the same selectivities as YMC*Gel. This means right from the start, there is the full range of C18/C8/C4/Phenyl and all other materials available in HG quality.
The result: New silica base + conventional bonding = same reliability + lower costs.
If you want more information, or if you want to apply for a sample, please contact YMC Europe directly in Germany, Phone: +49 (0)2064 427-270, Fax: +49 (0)2064 427-222 or visit www.ymc.de
